| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Impact of Current Induced Joule Heat Variation on Low Melting Temperature Solder Joint Stability |
| Author(s) |
Tae-Kyu Lee, Jimmy-Bao Le, Chuanhao Nie, Young-Woo Lee, Hui-Joong Kim, Seul-Gi Lee, Greg Baty, Gnyaneshwar Ramakrishna, Choong-Un Kim |
| On-Site Speaker (Planned) |
Tae-Kyu Lee |
| Abstract Scope |
Recently developed High performance chip components have large body sizes over 85x85mm2 and contain high warpage characteristics during board assembly. The board assembly peak temperature reaches 250oC in case of SAC305 solder interconnect configuration, which trigger warpage induced defects at the solder interconnects. Although the thermo-mechanical reliability performance of low melting temperature solder material showing stable performance levels, it is reported that the solder interconnects under higher level of current can cause Bi segregation and degrade in electrical and mechanical stability. The presented study identifies development of the joint microstructure changes under various current density and the various current density induced joint joule heat condition. 300m solder joints with SAC305, Sn-Bi, and Sn-Bi hybrid joints are current stressed from 0-4000 A/cm2 in various PCB test structures, which generate different heat dissipation conditions. The long-term current stressed joint microstructure evolution per configuration and test conditions are analyzed and discussed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, Phase Transformations |