| About this Abstract |
| Meeting |
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Symposium
|
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Presentation Title |
Structural Stability During Thermal Post-curing of Direct Ink Write Thermoset Composites |
| Author(s) |
Stian Romberg, Anthony Kotula |
| On-Site Speaker (Planned) |
Stian Romberg |
| Abstract Scope |
Thermoset composites are excellent candidates for direct ink writing because they shear thin during extrusion but retain their shape once deposited via a yield stress. However, thermal post-curing is often required to solidify these materials, which can destabilize printed parts. To understand instability during post-curing, we utilize rheo-Raman spectroscopy to simultaneously measure rheological properties and extent of reaction (i.e., conversion) at different temperatures. Although elevated temperatures accelerate the curing process, they decrease the yield stress before crosslinking solidifies the material, explaining why collapse occurs during thermal post-curing. On the other hand, curing at lower temperatures reduces instability at the cost of processing speed. The simultaneous Raman-based conversion measurements are used to determine when temperature can be increased without risking structural collapse. The results enable the design of a curing schedule that avoids instability, but still quickly drives the reaction towards full conversion. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |