| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Additive Manufacturing and Innovative Powder/Wire Processing of Multifunctional Materials
|
| Presentation Title |
Microstructure of Pure Copper Using Material Extrusion Additive Manufacturing (MEX) Process and Its Mechanical and Electrical Conductivity Properties |
| Author(s) |
Na Yoon Yee, So-Yeon Park, Michelle Baek, Kee-Ahn Lee |
| On-Site Speaker (Planned) |
Na Yoon Yee |
| Abstract Scope |
In the case of copper, the application of additive manufacturing technologies (AM) such as PBF and DED is limited, and sintering-based AM has recently been investigated. In this study, pure copper was fabricated by material extrusion additive manufacturing (MEX) process and its mechanical and electrical conductivity properties were evaluated. The as-sintered copper exhibited an internal density of more than 99.02% and an average grain size that varied with height. Tensile tests showed a yield strength of 74.79 MPa and a tensile strength of 200.16 MPa. Elongation varied with building height, ranging from 49.70% to 57.96% and increasing towards the bottom. Impact testing showed a toughness of 40.40 J/cm2, similar to or slightly lower than the casting (41.60 J/cm2). The electrical conductivity was 44.83 MS/m, which was superior to other laser-AM parts. In addition, we discussed the way to improve various properties by introducing post-processing such as hot isostatic pressing. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Copper / Nickel / Cobalt, Other |