| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
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| Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
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| Presentation Title |
Microstructure Evolution and Phase Transformation of Ni-Sn Compounds aAfter Long-Term Storage |
| Author(s) |
Yi-Wun Wang, Cheng-Ting Tsai, Tzu-Yi Lin |
| On-Site Speaker (Planned) |
Yi-Wun Wang |
| Abstract Scope |
The type of solder and surface finish directly influence the joint quality. Sn58Bi solder and ENEPIG substrate are used in this study. Low-melting point and long shelf life are the advantages of Sn58Bi and ENEPIG respectively. Ni3Sn4 is a common compounds in the reaction between Sn-based solder and Cu substrate. However, low-temperature phase of NiSn4 is rare observed after bonding. NiSn4 growth is systematically observed in this study. The aim of this study is to investigate the effects of Sn58Bi and ENEPIG on Ni-Sn compounds growth during low-temperature bonding. It has positive effect on reducing energy use. The important results are as follows: (1) NiSn4 is the dominant phase during 160 oC reflow; (2) NiSn4 and Ni3Sn4 formed after 120-130 oC aging; (3) No failure microstructure was observed in the reaction between Sn58Bi and ENEPIG.
Keywords: Sn58Bi, ENEPIG, Ni-Sn Compounds, Microstructure |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, |