About this Abstract |
Meeting |
2020 TMS Annual Meeting & Exhibition
|
Symposium
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Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
Presentation Title |
Effect of Sn3.0 Ag 0.5Cu and Sn58Bi Solder Alloys on Through Silicon Via under Thermal Conditions |
Author(s) |
Jiaojiao Wang, Limin Ma, Fu Guo, Yishu Wang, Jianyu Feng |
On-Site Speaker (Planned) |
Jiaojiao Wang |
Abstract Scope |
Through Silicon Via (TSV) is considered as a novel and significant three-dimensional packaging technology as result of its high degree of technical freedom. The coefficients of thermal expansion (CTE) mismatch among various materials in TSVs, therefore the negative reliability problems under thermal conditions can’t be overlooked. In this paper, TSVs were experienced thermal cycling between -55℃~125℃ and thermal aging between 80℃~120℃. The samples exhibited deformation and failure such as bulging and cracking. The results of Raman spectrums showed that tensile stress of the top of TSVs filled with Sn3.0 Ag 0.5Cu and Sn58Bi solders was proportional to the peak temperature of thermal loads. The failure behaviors of the solder such as swelling and cracking were relevant to the tensile stress. Meanwhile, EBSD analysis showed that the grain size of TSVs increased with the increase of peak temperature, and the grain orientation was related to the thermal stress. |
Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |