| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Impact of Temperature Gradient on the Growth of Intermetallic Compounds in Solid-State Cu and In-Solder System |
| Author(s) |
Po-Hsun Yang, Pei-Ni Jiang, Fan-Yi OuYang |
| On-Site Speaker (Planned) |
Po-Hsun Yang |
| Abstract Scope |
As solder joints shrink and stacked chips are utilized in advanced packaging technology, a significant temperature gradient could induce thermomigration and reliability issues. In addition, low-temperature solders, such as indium (In) and gallium (Ga) have been regarded as solutions for low-temperature bonding technology to avoid thermal damage during bonding processing. In this study, Cu thin films with solid state In solder were used to investigate the microstructure evolution and the growth of intermetallic compound (IMC) under a temperature gradient of 1955 ℃/cm for 1800 hours. In contrast to an asymmetrical IMC growth in Sn-based systems under thermomigration, we found a symmetrical growth of IMC at the hot and cold end with In atoms moving toward the hot end and Cu atoms migrating to the colder end. The corresponding mechanism will be discussed in detail in the talk. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Thin Films and Interfaces, Phase Transformations |