| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Advancing Reliability in Low-Temperature Solders Using Hybrid SAC/SnBi Alloys
|
| Author(s) |
Po-Kai Chang, Shang-Yang Chen, Kelvin Li, Chang-Meng Wang, Albert T. Wu |
| On-Site Speaker (Planned) |
Po-Kai Chang |
| Abstract Scope |
The adoption of low-temperature solders (LTS) in electronic device fabrication is a promising strategy to reduce thermal budgets and achieve substantial energy savings. Nevertheless, Sn-Bi solder alloys often encounter reliability challenges due to the coarsening of the Bi-rich phase, which tends to segregate at the interface between under-bump metallization (UBM) and solder balls during operation. Recent studies indicate that hybrid joint systems combining Sn3Ag0.5Cu (SAC) with LTS could enhance reliability. This research explores the interfacial reactions and microstructural evolution in various SAC/Sn-Bi hybrid systems. Through comprehensive microstructural and elemental analyses, along with reliability assessments including shear strength and electromigration tests on a daisy chain test vehicle, the study presents findings on the reliability performance and microstructural modifications of these hybrid solder systems. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Other, Other |