About this Abstract |
Meeting |
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
Symposium
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2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
Presentation Title |
Understand Powder Deposition Behaviors of a Novel Electrostatic Powder Spreading Technique Using Particle Dynamics Simulation |
Author(s) |
Ziheng Wu, Michael Troksa, Eric Elton |
On-Site Speaker (Planned) |
Ziheng Wu |
Abstract Scope |
Powder bed fusion is gaining more industrial presence across many sectors due to its increasing productivity. Most of the current process improvements focus on beam optimization while limited attention has been paid to modifying the spreading technique. Many industries show interest in multi-material printing as their applications can leverage the beneficial properties of several materials. However, almost all the existing spreading methods are mechanical based which prevents the deposition of different feedstocks selectively. We are developing a contact free electrostatic powder spreader that can perform multi-material powder patterning and in-situ mixing. This study focuses on developing custom modules in Ansys Rocky to perform powder dynamics simulations which have been validated against the deposition rate experiments using the electrostatic spreader. The simulations are used to study the different powder responses at various spreader geometries, electric fields, and materials. The results provide us with essential insights and guidelines for spreader prototyping. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |