| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Anisotropic Effects in Electromigration Enhanced Intermetallic Growth in Sn Based Solders |
| Author(s) |
Fariha Haq, Andrew Pham, Marisol Koslowski |
| On-Site Speaker (Planned) |
Fariha Haq |
| Abstract Scope |
Electromigration failure has become more acute due to the miniaturization of the solder bumps in flip-chip packages. In this work, we develop a multi-physics phase-field model to predict the electromigration-enhanced evolution of intermetallic compounds (IMC) as well as the depletion of Cu in the cathode. We simulate polycrystalline Sn solder joints having grains with different orientations to observe the effect of Sn anisotropy on electromigration failure and to understand the IMC formation along Sn grain boundaries with different Sn grain microstructures. The results are in good agreement with the experimental work. The objective of this research is to provide an extensive understanding of the effect of the microstructure to predict reliability issues and improve the design of microelectronic devices. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Phase Transformations, Thin Films and Interfaces, Modeling and Simulation |