| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
The Effect of Ag Addition on the Performance of In-Rich Binary Solder |
| Author(s) |
Mohd Arif Anuar Salleh, Tan Yi Pei, Flora Somidin, Kazuhiro Nogita |
| On-Site Speaker (Planned) |
Mohd Arif Anuar Salleh |
| Abstract Scope |
The effect of Ag addition on the microstructure and phase equilibria of In-Sn alloy systems with high indium content has been investigated. Phase diagram studies and microstructural characterization of In-Sn-Ag alloys with varying Ag concentrations have revealed significant changes. Changes in melting behaviour and microstructure provided insights into the distribution of phases and the effect of Ag on the grain structure and morphology. The findings suggest that the judicious selection of Ag content can be used to tailor the microstructure of In-Sn alloys for specific applications. This study contributes to the understanding of the role of Ag in modifying the phase equilibria and microstructure of In-Sn alloys with high indium content, paving the way for further research on their potential applications in various fields. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Electronic Materials, Solidification |