| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Achieving Collapse-free Joint in 3D-package by Hybrid Solder Alloy with Reducing Thermal Budget Usage |
| Author(s) |
Tzu-Ting Chou, Yu-Ching Wang, Jenq-Gong Duh, Rui Wen Song |
| On-Site Speaker (Planned) |
Rui Wen Song |
| Abstract Scope |
The hybrid solder with the improved infrastructure of Sn-Ag-Cu/Sn-Bi was introduced to solve the concern of overweight of stacked dies in 3D-package. Through combining Sn-3.0Ag-0.5Cu and Sn-58Bi solder with two different melting points, the reflow temperature was successfully reduced to 185℃ as compared to 260℃ of traditional Sn-3.0Ag-0.5Cu solder. Such a low bonding temperature could not only reduce the thermal expansion but also result in lower thermal budget during reflowing process. Furthermore, hybrid solder would diminish the issue of infrastructure collapse in 3D-package. As Sn-Ag-Cu part of hybrid solder was allowed to maintain solid when reflowing, the solid portion could serve as spacer to support the weight of stacked dies. In Sn-Ag-Cu/Sn-Bi/Cu joints, the large amounts of potential harmful Ag3Sn particles were observed to form along the interfacial Cu6Sn5 layer at the Sn-Bi/Cu interface. However, by using Sn-Ag-Cu-Ni/Sn-Bi solder, these interfacial Ag3Sn particles were effectively suppressed. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |