About this Abstract |
Meeting |
MS&T22: Materials Science & Technology
|
Symposium
|
Innovative Process Design and Processing for Advanced Structural Materials
|
Presentation Title |
K-12: Improvement of Structural Stability and Characterization of Nanoscale Defects in Amorphous Alumina Thin Film |
Author(s) |
Jeong-Hyun Woo, Gyeong-Seok Hwang, Hyeonji Yoo, Ju-Young Kim |
On-Site Speaker (Planned) |
Gyeong-Seok Hwang |
Abstract Scope |
Amorphous alumina thin films grown by atomic layer deposition (ALD) have been used for flexible devices as a dielectric layer and encapsulation due to their high density. However, oxide materials such as alumina and silica have brittle behavior and low flexibility.
In this study, 50 nm thick-alumina thin films show an elastic limit of 3.09% through tensile tests. However, encapsulation performance degrades even after cyclic deformation within elastic limit by pinhole formation. To improve structural stability and suppress pinhole formation, plasma pre-treatment is introduced before ALD process to form OH- ligands and eliminate the dangling bonds that cause the pinhole formation. In this study, we analyze the mechanism of pinhole formation by XPS analysis and MD simulation.
This work was supported by the National Research Foundation of Korea (NRF) grants funded by the Korean government (MSIT) (2020R1A5A6017701) and the Ministry of Trade, Industry and Energy (MOTIE, Korea) (20011735) |