| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Rare Metal Extraction & Processing
|
| Presentation Title |
Recycling of Copper and Gold from Waste Printed Circuit Boards by Leaching Followed by Solvent Extraction |
| Author(s) |
Kamalesh Singh, Mudila Dhanunjaya Rao |
| On-Site Speaker (Planned) |
Kamalesh Singh |
| Abstract Scope |
This article presents a two-stage, eco-friendly hydrometallurgical route for the recovery of gold from the delaminated metallic layers of waste mobile phone Printed Circuit Boards (PCBs). The downsized PCBs treated with an organic solvent dimethylacetamide (DMA) for the separation of metallic fraction from non-metallic glass fiber. The liberated metallic sheets are used for the selective dissolution of copper in an aqueous leaching reagent. Influence of various parameters such as type of leaching reagent, the concentration of the solution, temperature, time and pulp density are optimized for the effective leaching (almost 100%) of copper. Results show that 3M nitric acid is a suitable reagent for copper leaching but gold remained in solid residue. In the second stage, the separated residue is used for the recovery of gold by sulphuric acid with a combination of halide salt. Results have shown that almost 92 % of gold is recovered at the optimized parameters. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Hydrometallurgy, Extraction and Processing, Other |