| About this Abstract |
| Meeting |
Materials Science & Technology 2020
|
| Symposium
|
Manufacturing and Processing of Advanced Ceramic Materials
|
| Presentation Title |
Laser Shock Processing of Silicon Carbide Ceramics |
| Author(s) |
Fei Wang, Xueliang Yan, Chenfei Zhang, Leimin Deng, Yongfeng Lu, Michael Nastasi, Bai Cui |
| On-Site Speaker (Planned) |
Bai Cui |
| Abstract Scope |
Laser shock processing (LSP) is a novel advanced manufacturing technique that utilizes a nanosecond pulse laser to generate plasma-driven shock waves, which can induce a high compressive residual stress to a depth of about 1 mm from the surface. Compared to metals, the application of LSP to ceramic materials is limited and the associated mechanisms are poorly understood. Our research has reveal the fundamental mechanisms underlying the microstructural changes and mechanical properties in ceramic materials (such as α-SiC) in the LSP process. TEM characterizations revealed significant dislocation activities near the surface and grain boundaries, suggesting that the localized plastic deformation was generated by LSP at room temperature. X-ray diffraction analysis showed that the compressive residual stress can extend from the surface to a depth of 750 µm. The LSP-induced localized plasticity can improve the mechanical properties of SiC ceramics, such as the apparent fracture toughness and bending strength. |