| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Ultrafine-grained and Heterostructured Materials (UFGH XIII)
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| Presentation Title |
Tensile Deformation Behavior of a Nanocrystalline Cu-2.7at.%Zr Supersaturated Solid-Solution Alloy Processed by the High-Pressure Torsion |
| Author(s) |
Takahiro Kunimine, Kenta Miyamoto, Ryoichi Monzen, Reza Gholizadeh, Nobuhiro Tsuji |
| On-Site Speaker (Planned) |
Takahiro Kunimine |
| Abstract Scope |
Nowadays, Cu alloys for electronic components such as connectors are required to possess both high strength and electrical conductivity for downsizing of electronic devices. Applying severe plastic deformation (SPD) to materials is an efficient way to obtain high-strength nanostructured materials. A nanocrystalline Cu-2.7at.%Zr supersaturated solid-solution alloy can be synthesized by applying the high-pressure torsion (HPT) processing on a hypoeutectic Cu-2.7at.%Zr alloy due to the mechanical dissolution of the Cu5Zr phase. Here, we report on the tensile deformation behavior of the nanocrystalline Cu-2.7at.%Zr supersaturated solid-solution alloy processed by the HPT. Tensile tests were performed at room temperature (RT) and 77 K. The ultimate tensile strength of the nanocrystalline alloy was 1660 MPa at RT. This value is significantly higher than that of the conventional Cu alloys. The strengthening mechanisms of the nanocrystalline alloy can be reasonably explained by the grain boundary strengthening, dislocation strengthening, and solid-solution strengthening. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Characterization, Mechanical Properties |