| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Effect of In and Zn Addition on the Interfacial Reaction of Sn-Bi/Cu Solder Joints |
| Author(s) |
Pei-Kang Wu, Fu-Ling Chang, Yu-Hsin Lin, Meng-Chi Chuang, C. Robert Kao |
| On-Site Speaker (Planned) |
Pei-Kang Wu |
| Abstract Scope |
In this study, the individual and combined influences of In and Zn on the properties of Sn-Bi solder, as well as the morphologies and growth kinetics of IMC in Sn-Bi/Cu solder joint were investigated. For the Sn-Bi/Cu solder joint, Cu6Sn5 was formed at the interface after reflow. During the aging process, the thickness of the interfacial Cu6Sn5 IMC increased, promoting the accumulation of the Bi phase at the interface. However, the accumulation of the brittle Bi phase might deteriorate the shear strength of solder joints. With the addition of Zn, Cu5Zn8 was formed at the Sn-Bi-Zn/Cu interface. Because the growth of Cu5Zn8 doesn’t consume Sn during the aging process, it can effectively suppress Bi phase accumulation. The solid-state interfacial reaction was investigated at 80°C, 100°C, and 120°C for up to 1000 hours. A shear test was also conducted to examine whether Bi accumulation would deteriorate the shear strength. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Energy Conversion and Storage, Electronic Materials, Computational Materials Science & Engineering |