| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Cryogenic Mechanical Properties and Time-temperature Dependent Phase Transformations of Ultra-low Temperature In-Sn-Bi Solder Alloys |
| Author(s) |
Jiye Zhou, Xin Fu Tan, Qinfen Gu, Stuart D McDonald, Kazuhiro Nogita |
| On-Site Speaker (Planned) |
Jiye Zhou |
| Abstract Scope |
In-Sn-Bi solder alloys are considered as promising candidates for the aerospace industry and cryogenic applications due to unique processing opportunities associated with their ultra-low ternary eutectic temperature of 57.63 °C. Tensile testing was performed to investigate the mechanical
properties of alloys in this ternary system, between -20°C and -90°C. Alloys tested had a range of Bi concentrations from 15 to 34wt% Bi, including a near-eutectic alloy of In-30wt%Bi-20wt%Sn. All compositions showed excellent ductility at room temperature, where a 259.4% elongation is detected in the near eutectic composition while a significant decrease in ductility was observed at -90°C. In-situ synchrotron powder X-ray diffraction (PXRD), in-situ cooling scanning electron microscopy (SEM), electron backscatter diffraction (EBSD) and nanoindentation were applied to study the time-temperature dependent microstructure and phase transformation mechanisms and the contribution of these to the mechanical properties. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Solidification, Characterization |