About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
|
Symposium
|
Advanced Characterization Techniques for Quantifying and Modeling Deformation
|
Presentation Title |
Micro-Scale Digital Image Correlation for Reliability Characterization of Epoxy/Al Joint in High Precision Sensing Camera Assembly |
Author(s) |
Minhyuck Lee, Minjeong Sohn, Seongkyu Choi, Nakyung Jeong, Sang-Eui Lee, Tae-Ik Lee |
On-Site Speaker (Planned) |
Minhyuck Lee |
Abstract Scope |
The thermo-mechanical reliability of sensing camera modules for smart cars should be increasingly enhanced for high performance and durability against temperature changes. For recent applications, the reliability is critically affected by the adhesive properties of the camera module. Adhesive materials at interfaces exposed to repetitive temperature changes or extreme
environments can cause continuous internal stress at the joints, ultimately leading to adhesive delamination. This study focused on sensing camera modules produced through an active alignment bonding process and dual curing. To analyze the effect of epoxy adhesive material, mechanical deformations were systematically observed using digital image correlation (DIC). The results confirmed that the maximum stress is concentrated at the interface between the camera module housing and epoxy. In addition, the visualized DIC strain map effectively revealed the degradation mechanism of the epoxy joint under harsh environment by analyzing the deformation result after thermal shock testing. |
Proceedings Inclusion? |
Planned: |
Keywords |
Aluminum, |