| About this Abstract |
| Meeting |
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
| Symposium
|
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
| Presentation Title |
High Temperature Thermal Conductivity Measurement Using Two-Color Thermal Imaging |
| Author(s) |
Jonathan Malen, Hao-Yuan Cheng, Alexander J Myers |
| On-Site Speaker (Planned) |
Jonathan Malen |
| Abstract Scope |
We describe the development of a methodology to measure the thermal conductivity of AM materials at ultra-high temperatures (up to 4000 K). We use a two-color thermal imaging technique with a commercial color camera to measure the temperature distribution on a sample heated by a stationary laser heat source in a Directed Energy Deposition (DED) additive manufacturing machine. The radial temperature distribution is fit to a solution to the heat diffusion equation where the temperature dependent thermal conductivity is used as a fitting parameter. We evaluate the robustness of our proposed method using reference materials with known high temperature thermal conductivity, including Tungsten, Tungsten Carbide, and Tantalum. Unlike current pulse methods that have been previously used, our laser based approach is applicable to electrical insulators. Temperature dependent thermal conductivities are critical to optimize and understand AM processes and also for aerospace and energy applications with extreme environments. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |