| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Nano and Micro Additive Manufacturing
|
| Presentation Title |
From 2D to 3D Electrochemical Microfabrication of Copper and Nickel Based Materials: Synthesis, Microstructure and Mechanical Properties Under Extreme Loading |
| Author(s) |
Killang Pratama, Patrik Schürch, Jakob Schwiedrzik, Manish Jain, Chunhua Tian, Rajaprakash Ramachandramoorthy, Wabe W. Koelmans , Johann Michler |
| On-Site Speaker (Planned) |
Johann Michler |
| Abstract Scope |
3D printing of microscale parts by direct electrodeposition using a voxel-by-voxel printing technique is so far very challenging. Here, we show 3D additive-micromanufacturing (µAM) based on localized electrodeposition to fabricate Cu and Ni micro-pillars. A two-step approach that synthesizes a core-shell (Cu-Ni) structure is also shown, which combines high processing speed with excellent mechanical properties.
For core-shell structures first 3D µAM fabricated the dog-bone shape of Cu micro-pillars. Second, these pillars were coated with hundreds of nanometers thick layer of nanocrystalline Ni by pulse-reverse electrodeposition. Finally, we demonstrate the stable and successful room temperature (RT) electro-chemical printing of Ni micro-architectures. By performing micropillar compression tests, the printed pillars exhibit a high compressive yield strength of 2.3 ± 0.1 GPa. Thus, by deposition of stronger, but less noble metals we show a new pathway to enhance the mechanical robustness of 3D-printed structures, opening up new applications where mechanical rigidity is essential. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Copper / Nickel / Cobalt, |