| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Printed Electronics and Additive Manufacturing: Advanced Functional Materials, Processing Concepts, and Emerging Applications
|
| Presentation Title |
Additive Manufacturing of Interconnect Structures for Microelectronics Packaging Applications |
| Author(s) |
Michael Cullinan |
| On-Site Speaker (Planned) |
Michael Cullinan |
| Abstract Scope |
Development of three-dimensional (3D) electronic packages that allow multiple functionalities to be included in a single electronic device will become increasingly important as connectivity across devices continues to expand. Unfortunately, the current back-end-of-line (BEOL) fabrication processes required for interconnect fabrication are limited by the resolution barriers and reaction kinetics of the electrochemical deposition (ECD) process. Therefore, there is significant demand for an improved process that can enable high throughput fabrication of small, complex, high-density metal interconnects. Microscale additive manufacturing of these structures directly onto electronic devices has the potential to overcome these manufacturing limitations, but current micro-additive techniques all have major drawbacks in terms of the materials and structures that can be produced. This talk will discuss several recent advances in 3D printing of interconnect structures for electronic packaging applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Electronic Materials, Nanotechnology |