| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advances in Multi-Principal Element Alloys II
|
| Presentation Title |
Ultra-low Thermal Conductive Metallic Material: High Entropy Alloy Foam |
| Author(s) |
Kook Noh Yoon, Khurram Yaqoob, Je In Lee, Jin Yeon Kim, Eun Soo Park |
| On-Site Speaker (Planned) |
Kook Noh Yoon |
| Abstract Scope |
Generally, it is well-known that the thermal conductivity of the metallic material decreases as the number of alloying elements increases. In this point of view, high entropy alloy (HEA), which is constituted of several principal elements, will exhibit abnormally low thermal conductivity for metal due to the high lattice distortion.
Meanwhile, a porous body can also offer a great hindering effect on heat flow through materials. Thus, porous HEA can offer lower thermal conductivity than any other metallic material owing to the combination effect of composition and structure. In the present study, therefore, we fabricated HEA foam by dealloying a phase separating HEA, FeCoCrNi-Cu. In particular, we will systematically assess the property correlation between thermal conductivity and strength depending on the porosity. Indeed, we develop novel HEA foam with ultra-low thermal conductivity and high strength, which might be successfully applied as a heat shield material. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
High-Entropy Alloys, Phase Transformations, Characterization |