| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
Frontiers in Solidification Science VIII
|
| Presentation Title |
Using Composition and Patterning to Induce Solidification Instabilities in Al-Cu Eutectic Thin Films |
| Author(s) |
Eli Sullivan, John Tomko, Jonathan Skelton, James Fitz-Gerald, Patrick Hopkins, Jerrold Floro |
| On-Site Speaker (Planned) |
Eli Sullivan |
| Abstract Scope |
Directional laser melting and solidification in sputtered eutectic Al-Cu thin films can produce highly regular lamellae with spacings < 50 nm. This lamellar structure resembles a network of nearly identical, parallel interfaces, which could prove useful in studying interfacial effects and anisotropy in electronic and thermal transport. Within the context of the transport, it is also interesting to create and investigate non-parallel lamellar structures. In hypoeutectic films, oscillatory instabilities can emerge, and at lower scan speeds near the transition to dendritic growth, highly tortuous lamellar structures form over extended areas. We can further attempt to tailor instability by deliberately adding physical hole defects into a eutectic film prior to melting via focused ion beam (FIB) milling. A single nanoscale FIB defect can affect lamellae several spacings away by inducing morphological tilt waves. FIB hole arrays can produce many interacting waves. Support of the NSF under grant DMR-1663085 is gratefully acknowledged. |
| Proceedings Inclusion? |
Planned: |