| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
Electroplating of Rhodium using Pulse Current Plating Method |
| Author(s) |
Seo-Hyang Lee, Jaeho Lee |
| On-Site Speaker (Planned) |
Jaeho Lee |
| Abstract Scope |
The electrodeposition of rhodium (Rh) on silicon substrate at different current conditions were investigated. The cracks were found at high current density during the direct current (DC) plating. The pulse current (PC) plating were applied to avoid the formation of cracks on the deposits. Off time in the pulse plating relieved the residual stress of the Rh deposits and consequently the current conditions for the crack-free Rh deposits were obtained. The effects of additives on the surface morphologies were investigated. The heat treatments can make surface cracks due to the difference of CTE between Rh and substrate. Finally crack free Rh electroplating were obtained at elevated temperature. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |