About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
|
Symposium
|
Thin Films and Coatings: Properties, Processing and Applications
|
Presentation Title |
Enhanced Condensation Performance of High-Power Vapor Chamber by Electrodeposition and Surface Modification |
Author(s) |
Po Hsun He, Chao-Yang Chiang, Chien-Neng Liao |
On-Site Speaker (Planned) |
Po Hsun He |
Abstract Scope |
With the rapid development of technology, effective thermal management is crucial for electronic devices that consume a significant amount of power. Vapor chambers offer an efficient solution for heat dissipation in these devices, with a working fluid circulating between the evaporator and condenser. Effective condensation capability allows the gas to quickly release heat, convert back into liquid, and then transport back to the evaporation end. This maintains the internal circulation of the vapor chamber and enables stable heat dissipation under high power conditions. While vapor chambers feature low horizontal thermal resistance, high vertical thermal resistance poses a problem for heat transfer. By electrodepositing nickel and copper dendrites to increase surface roughness, we enhance the condensation efficiency of the gas within the chamber, enabling faster heat removal from the heat source. Simulations are used to verify and address condensation-related issues. |
Proceedings Inclusion? |
Planned: |
Keywords |
Thin Films and Interfaces, Surface Modification and Coatings, Copper / Nickel / Cobalt |