| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Deformation and Transitions at Grain Boundaries VII
|
| Presentation Title |
A Multiphysics, Mesoscale Framework to Predict the Creep-fatigue Life of Engineering Polycrystalline Alloys |
| Author(s) |
Andrea Rovinelli, Mark C. Messner, David M. Parks, T.L. Sham |
| On-Site Speaker (Planned) |
Andrea Rovinelli |
| Abstract Scope |
At high temperatures, the life of structural components is closely related to grain boundary (GB) network attributes. During fabrication, precipitates segregate at high energy GBs because of the energetically favorable configuration, becoming preferred sites for void nucleation. Crystallographic defects migrate from the grain bulk and remain trapped at GBs enhancing the void growth process. The coalescence of voids eventually results in intragranular fracture of the component. The time required to transition from void growth to intragranular fracture is closely related to the average GB character.
To predict the engineering properties of a polycrystalline alloys subject to creep loads we developed a microstructure sensitive mesoscale framework. The framework combines: a multiphysics crystal plasticity model to capture strain heterogeneity and defects diffusion, and (ii) a cohesive GB model sensitive to the local GB character. Computational results show that the creep-fatigue life can be improved by increasing the amount of low energy GBs. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |