About this Abstract |
Meeting |
MS&T24: Materials Science & Technology
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Symposium
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Additive Manufacturing of Metals: Microstructure, Properties and Alloy Development
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Presentation Title |
Computational Design of Crack-Free Cu-Inconel Functionally Graded Bimetallic Interfaces for Additive Manufacturing |
Author(s) |
Liyi Wang, Luis Fernando Ladinos Pizano, Michael Klecka, Wei Xiong |
On-Site Speaker (Planned) |
Liyi Wang |
Abstract Scope |
Bimetallic components printed using directed energy deposition between copper- and nickel-based alloys offer excellent thermal conductivity and strength, making them ideal for extreme environments. However, the interface between these bimetallic components is prone to cracking. In this work, we implemented a CALPHAD-based ICME framework to model the non-equilibrium solidification process, phase stability, and cracking susceptibility as a function of alloy composition, aiming to design crack-free interfaces between C18150 and Inconel 625 alloys. The simulation results were validated by using wire arc additive manufacturing. Crack-free interfaces were printed by introducing intermediate layers with a composition of 35 wt.% C18150 mixing with In625, as suggested by the modeling. This research highlights the power of computational tools in predicting and preventing crack formation between bimetallic materials in additive manufacturing. Furthermore, we pioneered the correlation between the cracking susceptibility of materials and liquid phase separation, providing a new perspective for designing functionally graded materials. |