| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Molecular Dynamics Study of the Effect of Ultrasonic Vibration on Evolution of Crystal Defects |
| Author(s) |
Milad Khajehvand, Henri Seppänen, Panthea Sepehrband |
| On-Site Speaker (Planned) |
Milad Khajehvand |
| Abstract Scope |
Ultrasonic wire bonding is an interconnection technique used in microelectronics packaging. Despite the well-studied general aspects of this process, the fundamental physics of the bonding mechanisms remain unknown. In our previous works, through Molecular Dynamic (MD) simulations, we have shown that contaminant-free surfaces, in close vicinity, can jump together and make bonds, a phenomenon known as Jump-to-Contact (JC). JC is found to result in dislocation generation/multiplication, which can significantly affect the diffusional mechanisms and phase transformations following contact. In this work, MD simulations are used to study the evolution of crystallographic defects during ultrasonic vibration of two FCC metallic substrates. For this purpose, two substrates are brought into a close vicinity until JC happens and contact forms. Then, the effect of vibration (magnitude and speed) and substrates’ thickness on the generation of dislocations and deformation twins is investigated. Vibration is expected to affect the bond characteristics through changing dislocation density/distribution. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |