| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Development of Low Temperature Sn-Bi based Solder Alloys |
| Author(s) |
Mehran Maalekian, Aranav Das, Ludo Krassenburg, Co van Veen, Mo Biglari |
| On-Site Speaker (Planned) |
Mehran Maalekian |
| Abstract Scope |
The eutectic or near eutectic Sn-Bi alloys are common lead-free solder alloys for low temperature soldering application in electronic industry. Poor formability and low ductility of this alloy system has limited its widespread application. To improve the formability the effects of In and Sb additions on the mechanical and soldering properties of Sn-Bi based solder alloy is investigated. In order to understand to what extent alloying additions can improve ductility of Sn-Bi solder while maintaining the melting temperature within an acceptable range, wetting contact angle, hardness, and microstructure evolution of the alloys are studied and compared against the reference Sn-Bi alloy. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |