About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
|
Symposium
|
Thin Films and Coatings: Properties, Processing and Applications
|
Presentation Title |
Enhancing Boiling Heat Transfer Performance of Superhydrophilic Cu Films with Electrodeposited Dendritic Structure |
Author(s) |
En-Chia Liu, Chien-Neng Liao |
On-Site Speaker (Planned) |
En-Chia Liu |
Abstract Scope |
Boiling heat transfer (BHT) has received emerging interest for providing highly efficient thermal management solutions in high-power density electronics cooling systems. BHT performance can be effectively improved by properly designing the boiling enhancement structure (BES) on the surface. In this study, we prepared superhydrophilic dendritic Cu films as BES by electrodeposition. Cu films with different thickness and morphologies were fabricated by tailoring the electrolyte composition. A conformal Ni layer was electrodeposited on the dendritic Cu structure to enhance the oxidation resistance. BHT performance of a surface can be characterized by heat transfer coefficient (HTC) and critical heat flux (CHF), which represent the heat transfer efficiency and limitation, respectively. We conducted pool boiling tests to obtain HTC and CHF of tested surface, evaluating the BHT performance of dendritic Cu films. Compared to the flat Cu surface, an optimized dendritic structure exhibits 84% increase in HTC and 78% increase in CHF. |
Proceedings Inclusion? |
Planned: |
Keywords |
Thin Films and Interfaces, Surface Modification and Coatings, Copper / Nickel / Cobalt |