| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Controlling Porosity During Transient Liquid Phase Soldering for Power Modules |
| Author(s) |
Kazuhiro Nogita, Nurul R. Abdul Razak, Xin F. Tan, Yiwei Chai, Michael J. Bermingham, Jeffrey Venezuela, Keith Sweatman, Stuart D. McDonald |
| On-Site Speaker (Planned) |
Kazuhiro Nogita |
| Abstract Scope |
Transient liquid phase (TLP) soldering takes advantage of the isothermal reaction occurring between a liquid solder and substrate to form an intermetallic compound (IMC) with a melting point higher than the soldering temperature. TLP allows a high-temperature solder joint to form at lower processing temperatures. The morphology and spatial distribution of the IMCs, as the solid joint evolves during processing, determine the distribution of any porosity that arises due to shrinkage or gas generated by the flux. In a worst-case scenario, a connected layer of planar porosity forms parallel to the substrates leaving a joint with little functional integrity. In this work, several novel techniques are proposed to encourage non-uniform IMC growth that has the potential to distribute any porosity in a controlled manner, resulting in improved joint properties. A combination of in-situ and ex-situ techniques is used to investigate the effectiveness of these TLP soldering processes. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Phase Transformations, Solidification, Characterization |