| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
|
| Presentation Title |
Superplasticity Deformation of Sn-Bi Based Solder Alloys |
| Author(s) |
Akira Yamauchi, Masashi Kurose |
| On-Site Speaker (Planned) |
Akira Yamauchi |
| Abstract Scope |
The superplasticity mechanism of Sn-based alloys has not been clearly established. Therefore, this study investigated the effects of third elements addition on the microstructures and superplasticity behaviors of Sn-Bi-based alloys. These alloys were subjected to tensile tests using various temperatures. Cu, Ni, Zn, and Sb-added Sn-Bi-based alloys demonstrate superplastic deformation at high temperatures. The strain rate sensitivity of Sn-Bi-based alloys at 80 ℃ exceeded 3.0, 3 is the threshold of superplasticity deformation behavior. These results suggested that the superplasticity deformation of Sn-Bi-based alloys was independent of the grain size of the primary Sn phase. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Mechanical Properties, |