| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Laser Manufacturing of High-Performance Materials
|
| Presentation Title |
Ultrafast Laser Dicing of Fused Silica Filled Epoxy Molding Compound (EMC): Process Mechanisms |
| Author(s) |
Sijie Zhang, Yung C. Shin |
| On-Site Speaker (Planned) |
Yung C. Shin |
| Abstract Scope |
The fused-silica-filled epoxy-molding compound (EMC) is widely used to encapsulate electronics during the packaging process in the semiconductor industry. After encapsulation, the wafer is diced into separate dies. The ultrafast laser-based dicing process is an effective method with flexibility in the cutting path, higher precision, and limited thermal damage to the material. A femtosecond laser was used to cut the fused silica-filled EMC with two different filler sizes. Three ablation mechanism ranges were identified, namely evaporation, direct ejection, and transition range. It was found that direct ejection can significantly improve the material removal rate and EMC with a larger filler size required higher laser power to initiate the direct ejection. The upper limit for the evaporation range and the lower limit for the direct ejection were determined. This study can provide key guidance for the optimization of process parameters during the ultrafast laser-based dicing process of composite materials like EMC. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Electronic Materials, Modeling and Simulation |