| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Influence of Substrates and Microalloying Additions on the Primary Intermetallic Growth of Lead-free Solder Joints |
| Author(s) |
Mohd Arif Anuar Mohd Salleh, Kazuhiro Nogita, Mohd Izrul Izwan Ramli, Flora Somidin, Yasuda Hideyuki |
| On-Site Speaker (Planned) |
Kazuhiro Nogita |
| Abstract Scope |
This paper investigates the influence of several substrates and microalloying additions on the microstructure of lead-free solder joints. The microstructure were mainly analysed using in-situ synchrotron imaging coupled with conventional microstructure observation techniques. Growth kinetics of primary intermetallics in the solder joints were also analysed and compared. Results shows that the substrate plays a significant role in the microstructure development in a lead-free solder joint. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |