| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
Alloys and Compounds for Thermoelectric and Solar Cell Applications IX
|
| Presentation Title |
Assessment of Electroless Cobalt Diffusion Layer for Bi2Te3-based Thermoelectric Module |
| Author(s) |
Albert T. Wu, Chun-Hsien Wang |
| On-Site Speaker (Planned) |
Albert T. Wu |
| Abstract Scope |
This study investigates the effect of using an electroless Co-P layer as the diffusion barrier when assembling thermoelectric module. The effect of adding the diffusion barrier on the interfacial reaction, mechanical behavior and thermoelectric properties of thermoelectric joints is discussed. When directly bonded solders with thermoelectric substrates, various intermetallic compounds (IMCs) form at the interface will affect the stability of the thermoelectric joints. The addition of a Co-P diffusion barrier will significantly improve the interfacial stability and effectively inhibit the formation of brittle IMC. The joint shear strength is greatly improved and the fracture mode becomes more ductile due to the added barrier layer. The addition of the Co-P diffusion barrier does not cause a significant deterioration in thermoelectric properties. These findings indicate that the Co-P layer is a promising diffusion barrier for Bi2Te3-based thermoelectric module. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Energy Conversion and Storage, Thin Films and Interfaces, |