| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Assessment of Solder Alloy for High Reliability Device |
| Author(s) |
Wei-Ting Lin, Kelvin Li, Watson Tseng, Chang-Meng Wang, Albert T. Wu |
| On-Site Speaker (Planned) |
Wei-Ting Lin |
| Abstract Scope |
Developing high-reliability solder materials is critical due to the demanding requirements of automobile electronics. This study investigates the reliability of new lead-free solder alloys. A new alloy that removes Cu, PF918 (Sn4Ag3Bi-X), has been developed for device assembly. In this study, PF918 and SAC (Sn3Ag0.5Cu) paste are assembled with SAC solder balls on CTBGA228 components for comparison. The assembled components are subjected to thermal aging at 125°C, drop tests (JESD22-B111A), and thermal cycle tests (IPC-9701B). Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray Spectroscopy (EDS) are used to analyze the microstructure and intermetallic compound (IMC) growth at fracture locations with varying failure numbers. Electron Backscatter Diffraction (EBSD) is employed to analyze samples after thermal cycle testing to investigate the relationship between stress relaxation, crack propagation, and the microstructure of the solder. The results show that PF918 is a promising candidate for high-reliability automobile devices. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Other, Other |