| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
Microstructure Evolution and Growth Behavior of Intermetallic Compound Between Cu and Sn-Ag Alloys |
| Author(s) |
Minho Oh, Naru Tokunaga, Equo Kobayashi |
| On-Site Speaker (Planned) |
Minho Oh |
| Abstract Scope |
This study investigates the microstructural evolution and growth behavior of intermetallic compound (IMC) layers in the Cu/(Sn-Ag) system during isothermal aging within the temperature range of 433–473 K. By systematically varying Ag content, aging temperature, and time, the fundamental mechanisms governing IMC formation and growth in Cu/(Sn–Ag) solder joints are elucidated. The addition of Ag significantly influences IMC nucleation and growth, with higher Ag content correlating with faster growth rates. The temperature dependence of IMC growth rates was also investigated, revealing that higher temperatures lead to increased growth rates, indicative of boundary diffusion-controlled growth. Activation enthalpies were calculated, providing quantitative insights into the faster growth rate of IMC thickness in the Cu/(Sn-2.00Ag) diffusion couple within the experimental temperature range. These findings offer valuable insights into factors affecting the reliability and performance of solder joints in electronic packaging applications. |
| Proceedings Inclusion? |
Planned: |