| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Enhancing Joint Strength and Microstructural Modification Through the Addition of Eco-friendly Nanofibers in SAC Solder |
| Author(s) |
Chia-Jung Hsu, Chang-Meng Wang, Yu-Cheng Chen, Tsao-Cheng Huang, Chao-Chin Chang, Albert T. Wu |
| On-Site Speaker (Planned) |
Chia-Jung Hsu |
| Abstract Scope |
The utilization of SnAgCu (SAC) solder alloy in electronic packaging is a well-established technology. The microstructure of SAC plays a critical role in ensuring the reliable performance of electronic devices. This study presents an innovative approach to modify the microstructure of the solder alloy by the adding nanofibers that are produced through an environmentally friendly method, facilitating their homogeneous dispersion within the SAC alloy. The composite SAC solder paste was subjected to reflow on glass and was analyzed by polarized optical microscopy and electron backscatter diffraction. The obtained findings demonstrate the successful refinement of the microstructure achieved through the addition of nanofibers. The SAC paste was reflowed onto a Cu substrate with a defined opening to evaluate mechanical strength of the joint. Analysis of the shear stress results presents the substantial enhancement in joint strength resulting from the incorporation of nanofibers. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Characterization, Mechanical Properties |