| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
|
| Presentation Title |
A-30: Electric Current-induced Unexpected Phase Transition for the ƞ'-Cu6Sn5 Phase at Low Temperatures |
| Author(s) |
Shubhayan Mukherjee, Shih-kang Lin |
| On-Site Speaker (Planned) |
Shubhayan Mukherjee |
| Abstract Scope |
In advanced packaging, high electric current density presents challenges by affecting material structure and stability. Intermetallic compounds (IMCs) form at the bond interface and are essential for reliable interconnections. Cu6Sn5, a common lead-free solder alloy, has two phases: hexagonal ƞ and monoclinic ƞ'. The phases form above and below the transition temperature of 186 ℃, respectively. The low-temperature monoclinic phase of Cu6Sn5 holds considerable advantages as a solder alloy in various aspects. However, our understanding of how electric current impacts these phases, and their transition remains limited. This study aims to investigate the low-temperature monoclinic phase (ƞ') of Cu6Sn5 and explore the influence of electric current on its stability and properties. Through subjecting the ƞ' phase to high-density electric current, we aim to gain valuable insights into the physical properties of Cu6Sn5. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Other, Other |