| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
In-situ Characterisation of the Time-temperature Dependent Structural Changes in Sn-Bi Alloys |
| Author(s) |
Xin Fu Tan, Qichao Hao, Jiye Zhou, Qinfen Gu, Stuart D. McDonald, Keith Sweatman, Kazuhiro Nogita |
| On-Site Speaker (Planned) |
Xin Fu Tan |
| Abstract Scope |
Low temperature solders have attracted interests because of their low liquidus temperatures, low costs and non-toxicity. While the solubility of Sn in Bi is relatively low, the solubility of Bi in Sn can range from ~3 w% at room temperature to ~21 wt% at the eutectic temperature at 139°C. The dissolution and precipitation of Bi into and out of Sn can cause significant changes to the microstructure, lattice, and properties of the Sn-Bi solders. In this work, the time-temperature dependent crystal structure changes of hypo-eutectic Sn-37wt%Bi and near-eutectic Sn-57wt%Bi solder alloys are characterised via in-situ synchrotron powder X-ray diffraction (PXRD). In-situ heating scanning electron microscopy (SEM) was employed to observe the corresponding microstructural changes. The results show the microstructural and crystal structural changes of the Sn and Bi phases are dependent on temperature, temperature ramp rate, isothermal holding time, the composition and the microstructure of the alloys. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Electronic Materials, |