| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
Alloys and Compounds for Thermoelectric and Solar Cell Applications IX
|
| Presentation Title |
Co-P Diffusion Barrier for Lead Telluride-based Thermoelectric Joints |
| Author(s) |
Kai-Wen Cheng, Hsien-Chien Hsieh, Albert T. Wu |
| On-Site Speaker (Planned) |
Kai-Wen Cheng |
| Abstract Scope |
PbTe-based alloys show excellent thermoelectric performance at medium temperature range. The formation of intermetallic compounds between thermoelectric materials and electrodes deteriorates mechanical joint strength and thermoelectric performance. In this study, directly bonded Ni and Cu electrode induced formation of IMCs and disintegration of the joints in both p- and n-PbTe modules. Severe interfacial problems are overcome by utilizing an electroless cobalt-phosphorus (Co-P) diffusion barrier. The mechanical strength is improved owing to the insertion of Co-P diffusion layer, and the additional layers yield acceptable contact resistance. In addition, the added layers enhance thermoelectric performance and thermal stability in p- and n-PbTe materials. The fabricated p-type and n-type PbTe-based thermoelectric joints meet the required criteria for improving efficiency of PbTe modules. |
| Proceedings Inclusion? |
Planned: |