ProgramMaster Logo
Conference Tools for 2025 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Abstract
Meeting 2025 TMS Annual Meeting & Exhibition
Symposium Electronic Packaging and Interconnection Materials II
Presentation Title Crystallographic Aspects of Phase Transformations in Sn-58Bi Low Temperature Solder
Author(s) Christopher M. Gourlay, Xiaomei Shen, Chen-Lin Hsieh
On-Site Speaker (Planned) Christopher M. Gourlay
Abstract Scope Sn-Bi-based low temperature solders are being increasingly used to reduce dynamic warpage and reduce energy consumption in electronics manufacturing. This presentation will overview research on the evolution of microstructure during phase transformations in Sn-58Bi solder balls and joints. The focus is on tin dendrite growth, eutectic growth and the solid-state precipitation of bismuth.
Proceedings Inclusion? Planned:
Keywords Electronic Materials, Characterization, Phase Transformations

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A New Method for High Precision Work of Adhesion Measurements of Micron-Scale Copper Bonds
A Study on Novel Thermal Interface Composite Indium-Based/Diamond Composite for High-Performance Computing Applications
Advanced Thermal Management in Electronics: Micro-Nano Copper Forest Wicks for Thin Vapor Chambers
Advancing Reliability in Low-Temperature Solders Using Hybrid SAC/SnBi Alloys
Ag-Nodule Mediated Bonding With Ag-Si Metastable Phase
Assessment of Solder Alloy for High Reliability Device
Blind Hole Filling With Nano-Twinned Copper in Bulid Up Pcbs
Characterization of FCQFN Solder Interconnects Incorporating Ni Metallization for Advanced High-Power Automobile Applications: An Electromigration Study
Comparative Research on Reliability Characteristics of Combined Pb-Free Solder Joints With Sn-Ag-Cu and Sn-Bi-Ag
Comparison Between Current Induced Joule Heat Variation on Near Eutectic and Off Eutectic Sn-Bi Solder Joint Stability
Crystallographic Aspects of Phase Transformations in Sn-58Bi Low Temperature Solder
Designing Mechanically Resilient Thermal Interface Materials
Developing High-Reliability Solder Alloys for Automotive Electronics
Effect of In and Zn Addition on the Interfacial Reaction of Sn-Bi/Cu Solder Joints
Electrical Current-Induced Phase Transformation and Enhanced Mechanical Properties in η'-Cu6Sn5 for Electronic Solder Joints
Electrochemical Migration Behavior and Its Improvement of Fine-Pitch Ag Interconnects
Electroless Plated Highly (111) Nanotwinned Cu-to-Cu Direct Bonding
Electromigration Behavior of Direct-Bonded Nano-Twinned Ag-Cu Bumps
Electromigration Failure Mechanisms and Microstructural Changes of Silver Sintered Joints Under Different Bonding Thickness
Enhancement of Strength and Aging Resistance in Sn-9Zn Alloys With Minor Bi Addition
Enhancing Low-Temperature Solder Reliability With Hybrid SAC/SnBi Systems
Impact of Cryogenic Thermal Cycling on Solder Interconnect Mechanical Stability
Impact of Temperature Gradient on the Growth of Intermetallic Compounds in Solid-State Cu and In-Solder System
Indentation Rate Response to Enable Property Mapping in Multiphase Solders
Influence of Minor Alloying Elements on the Properties of Sn-Bi Alloys
Influence of the Bi Phase Distribution on the Electrical and Thermal Properties of Sn-Bi Alloys
Innovative Graphene Coated Cu Powder for Sintering in Air Atmosphere
Inspection, Estimation, and Design of Hybrid Bonding Processes Using In-Situ Heating Atomic Force Microscopy
Interconnect-Based Sensor Array for Characterizing Thermal Management of IC Chips
Investigation of Electroless Ag-Passivated Cu-to-Cu Direct Bonding and Micro Cu Pillar Bonding
Investigation of Electromigration Lifetime for Cu-Cu Joints With Various Microstructures
Investigation of SiCN-SiCN Bonding With Different Wet Pretreatment Solutions for Cu Hybrid Bonding Applications
Low Temperature Cu-Cu Direct Bonding in Air ambient by Ultrafast Surface Grain Growth
Low Vacuum Bonding Using Nano-Twinned Silver and SiO2 for Heterogeneous Integration
Microstructural Evolution and Shear Strength of Nano-Ag Paste Joints With Variable Sintering Temperatures and Particle Sizes
Microstructural Fingerprints for Secure Microelectronic Packaging
Microstructures of Ag-In Transient Liquid Phase Bonding Using In-Coated Ag Sheet
Nanoindentation Study of Sn and Bi Phases in Sn-Bi Alloys
Oxygen-Free Cu Sinter Joining in the Air on Cold-Rolled Cu Substrates
Plasma-Free Surface Modification in Fine-Pitch Cu/SiO2 Hybrid Bonding
Reliability and Lifetime Predictions of Fine Pitch Ball Grid Arrays in Thermal Cycling
Reliability of Solder Joints Under Extreme Conditions of Elevated and Cryo Temperatures for In-Space Applications
Silver and Copper Sinter Joint Properties for 1200 V 60A Silicone Carbide MOSFET Power Modules
Sn-Bi Solder Alloys With Sb and Ag Additions: Effect of Microstructure on Mechanical Properties
Study of Electromigration-Induced Voids Formation in Solder Microbumps by Using 3D X-Ray Microscopy
Surface Precipitation and Growth Mechanisms of Bismuth Particles in Sn-Bi and Sn-Ag-Cu (SAC)-Bi Solder Alloys
Temperature and Strain Rate Dependence of Mechanical Properties in Sn-Bi Alloys
The Effect of Ag Addition on the Performance of In-Rich Binary Solder
The Effect of Grain Size on the Chemical-Mechanical-Planarization Removal Rate of Cu Films
The Effect of Recent Heating on the Room Temperature Microstructure of Sn-Bi Alloys
The Mechanisms for Enhancing Mechanical Properties Through Trace Element Addition in Sn-Bi Solder
Thermal-Structural Coupling Analysis of Cu-Cu Hybrid Bonding in 3D Stacked Die Configurations
Transparent Bonding of Flexible Substrates Without an Absorber by Using Laser Heating
Unveiling the Influence of Interfacial Microstructures on the Evolutions of Interfacial Strength and Electric Resistance of Lamellar Cu/Al/Cu Composites Fabricated by Ultrasonic Welding
Void Reduction in Indium TIM in BGA and Large Size Packaging
Wear Behavior of Cyanide-Free Silver Nanotwin Films Co-Deposited With Graphene

Questions about ProgramMaster? Contact programming@programmaster.org