About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection Materials II
|
Presentation Title |
Crystallographic Aspects of Phase Transformations in Sn-58Bi Low Temperature Solder |
Author(s) |
Christopher M. Gourlay, Xiaomei Shen, Chen-Lin Hsieh |
On-Site Speaker (Planned) |
Christopher M. Gourlay |
Abstract Scope |
Sn-Bi-based low temperature solders are being increasingly used to reduce dynamic warpage and reduce energy consumption in electronics manufacturing. This presentation will overview research on the evolution of microstructure during phase transformations in Sn-58Bi solder balls and joints. The focus is on tin dendrite growth, eutectic growth and the solid-state precipitation of bismuth. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Characterization, Phase Transformations |