| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Effects of Bismuth, Antimony, and Indium Alloying Elements on Microstructure of High Reliability Pb-Free Solders Alloys |
| Author(s) |
Richard Coyle, Babak Arfaei, Christopher M. Gourlay, Sergey Belyakov, Keith Sweatman, Keith Howell |
| On-Site Speaker (Planned) |
Richard Coyle |
| Abstract Scope |
Pb-free solder alloy development is being driven by rapidly evolving application requirements to resist damage from thermal fatigue, drop/shock and vibration loadings in aggressive product use environments. To address these performance requirements, numerous commercial Pb-free solders based on SnAgCu alloy system are being developed. These alloys have significant solute additions of bismuth (Bi), antimony (Sb), and indium (In) to promote solid solution and precipitate strengthening mechanisms. The effect of these elements on various aspects of microstructure such as the identification of specific phases in the β-tin matrix have not been fully determined. The current research work uses samples from a major industrial project to study the effects of Bi, Sb, and In on Sn grain morphology and to identify phases in ball grid arrays with different solder volumes. The effects of these alloying elements on thermal fatigue and the evolution of the microstructure resulting from thermal cycling will be discussed. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |