| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
D-2: A Novel Class of Multiscale Nanomaterials-based Thermal Interface Materials for High Temperatures, High Power Density Electronics |
| Author(s) |
Chunhu Tan, Shuyi Chen, Tim Lin |
| On-Site Speaker (Planned) |
Tim Lin |
| Abstract Scope |
This presentation reports a new class of hybrid, silver (Ag) nanomaterial–based TIM paste with elevated operation temperatures. This hybrid Ag-based TIM paste is featured with the incorporation of multiscale (from nano- to micro-size) Ag particles and Ag-nanocoated multi-wall carbon nanotubes (MWCNTs), which will enable a low-temperature, pressure-less bonding process. The sintered joint can provide not only high mechanical strength, but also the ability to “self-heal” should they be stressed to failure. The promising performance of this TIM include wide working temperature range (-60 to 250 degree C), enhanced mechanical/shear strength (>30 MPa) and thermal conductivity (>70W/m·K). In addition, this TIM paste can be directly applied to the current power electric packaging production lines, without application of external pressures and inert protective gases, allowing for a simplified, low-temperature process. This paste also can be used for solar cell metallization layers allowing for resilience to the presence of semiconductor cracks. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |