About this Abstract |
Meeting |
2020 TMS Annual Meeting & Exhibition
|
Symposium
|
Additive Manufacturing: Materials Design and Alloy Development II
|
Presentation Title |
Development of High Thermal Conductivity Aluminum Alloys Suitable for Additive Manufacturing |
Author(s) |
Andrew Bobel, John Hunter Martin, Julie Miller, Brennan Yahata, Jacob Hundley, Justin Mayer |
On-Site Speaker (Planned) |
Andrew Bobel |
Abstract Scope |
The addition of functionalizing additives on the printability, microstructure, and strength of pure aluminum powder was studied. Printability of pure Al via laser powder bed fusion is hindered by epitaxial growth of long columnar grains during the additive manufacturing process which lead to severe cracking and part failure thereby. Significant reduction in grain size, elimination of columnar grain growth, and improved printability has been previously demonstrated via the functionalization of 7075 aluminum additive powder. Here, we explore the addition of various nano- and micron-sized functionalizing additives to pure Al powder to similarly inhibit columnar grain growth, while maintaining the desired high thermal conductivity of pure Al. The additives effects on grain structure, thermal conductivity, and strength were explored in printed specimens and compared to those of printed pure Al. This work lays the foundation for the development of functionalized nearly pure aluminum with high thermal conductivity suitable for additive manufacturing. |
Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |