About this Abstract |
Meeting |
13th International Conference on the Technology of Plasticity (ICTP 2021)
|
Symposium
|
13th International Conference on the Technology of Plasticity (ICTP 2021)
|
Presentation Title |
Investigations and Improvements in 3D-DIC Optical Residual Stress Analysis – A New Temperature Compensation Method |
Author(s) |
Frederik Dahms, Werner Homberg |
On-Site Speaker (Planned) |
Frederik Dahms |
Abstract Scope |
With the follow-up objective of measuring and generating defined residual stress distributions in aluminium flanges formed by friction-spinning of tubes, this paper proposes residual stress measurement by linear guided translation of the specimen between hole-drilling and 3D-DIC image capturing process. The procedural benefit is the usage of an ideal camera calibration, respectively the angle between the cameras and the specimen, which leads to an optimal depth of field with a wide range measuring surface around the drill hole. Influences of the linear guided displacement of the specimen on the measuring accuracy were determined to be tolerably low. The measurement of heating curves in the illuminated measuring process proves a thermal induced systematically error. Therefore, a mathematical approach for subtraction of thermal induced strain is proposed. The obstruction of heat dissipation by the speckle pattern coating is also considered. Additionally, solutions for external influences like airflow and vibration are applied. |
Proceedings Inclusion? |
Definite: At-meeting proceedings |