| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Influence of the Bi Phase Distribution on the Electrical and Thermal Properties of Sn-Bi Alloys |
| Author(s) |
Choong-un Kim, Tae-Kyu Lee, Pushkar Gothe, Yujin Park, Gnyaneshwar Ramakrishna |
| On-Site Speaker (Planned) |
Choong-un Kim |
| Abstract Scope |
Advanced electronic packaging demands solder alloys with lower reflow temperature than the conventional alloys to enable heterogeneous integration and 3D stacking of devices. These alloys are known as the low temperature solder (LTS), and the best known examples are the alloys based on the Sn-Bi at near eutectic composition. These alloys are consisting of solid solution phases of Sn and Bi distributed in a classic lamella eutectic structure. This type of microstructure ideally provides electrical and thermal properties that are more or less a constant because the phase fraction is fixed by a composition and the scale of each phase is greater than the scattering length for electrons and phonons. However, a number of studies including our own show that the properties are not fixed but varies greatly with the phase distribution. This paper presents the mechanism behind such behaviors of Sn-Bi alloys discovered in our recent study. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Electronic Materials, Other |