| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Alloys and Compounds for Thermoelectric and Solar Cell Applications XIII
|
| Presentation Title |
Development of Ag-to-Ag Bonding Technique for Middle-High Thermoelectric Module |
| Author(s) |
Yu-En Tsai, Chien-Neng Liao |
| On-Site Speaker (Planned) |
Yu-En Tsai |
| Abstract Scope |
For commercial thermoelectric modules, solder paste techniques are commonly used along with a room temperature barrier system. However, middle-high temperature thermoelectric systems exhibit promising thermoelectric properties and require a robust bonding layer and diffusion barrier layer between the thermoelectric legs and metal electrodes to withstand thermal cycling and high-temperature aging. In this study, we sequentially deposited a Nickel/Palladium barrier and an Silver bonding layer for a middle-high temperature thermoelectric system, connecting N-type and P-type thermoelectric legs. By utilizing bonding conditions suitable for different types of thermoelectric systems with varying physical properties, our analysis shows that, compared to solder paste cases, this new design results in a much more stable bonding interface and resistance. This newly designed bonding system improves the thermal stability of middle-high temperature thermoelectric modules. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Energy Conversion and Storage, Thin Films and Interfaces |