| Abstract Scope |
The utilization of lead-free solders in microelectronic devices entails difficulties, particularly, the rapid growth of intermetallic compound layers that lead to brittle fracture in solder joints. This study has investigated the influence of ceramic nanoparticles (NPs) in Sn-3.5Ag solder on the evolution of the interfacial intermetallic phases and the mechanical performance of the solder joints. In contrast to the more pronounced approach of adding the nano-sized inclusions directly to the solder, various amounts of TiO2 and ZrO2 (0.0 – 1.0 wt.%) were introduced into the commercial flux. The produced solder joints were aged at different temperatures for varying durations, shear tests were performed, and the microstructure was examined. The results displayed a decrease in growth kinetics of the interfacial Cu-Sn IMC by the addition of ZrO2 NPs and an increase by including TiO2 NPs. Furthermore, initial additions of the ceramic NPs have resulted in a more positive effect. |