| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Synchrotron X-ray Study of Sn Electromigration, Sn Whisker Growth, and Residual Strain Evolution in A Blech Structure |
| Author(s) |
Pei-Tzu Lee, Wan-Zhen Hsieh, Cheng-Yu Lee, Xiao-Yun Li, Shao-Chin Tseng, Mau-Tsu Tang, Ching-Shun Ku, C. Robert Kao, Cheng-En Ho |
| On-Site Speaker (Planned) |
Pei-Tzu Lee |
| Abstract Scope |
Electromigration and Sn whisker growth both played key roles in microelectronic packaging reliability for past decades and a dynamic observation on these two issues are still quite lacking to date. In this study, we conducted a real-time analysis on Sn electromigration behavior and Sn whisker growth in a Blech structure via nano-X-ray fluorescence (nano-XRF) microscopy (beamline 23A, Taiwan Photon Source) and white X-ray nanodiffraction (beamline 21A, Taiwan Photon Source). The Sn depletion at the cathode and the Sn whisker/extrusion formation at the anode upon electron current stressing were in-situ characterized using nano-XRF, and the residual deviatoric strains of Sn films after electromigration were analyzed using white Laue diffraction. The knowledge would greatly advance our fundamental understandings of Sn electromigration/whiskering mechanisms. Details will be presented in this talk. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |